Semiconductor packaging technology is an indispensable process in electronics manufacturing, particularly for integrated circuits (ICs), sensors, and optoelectronic components. Dispensing encapsulation refers to the process of uniformly and precisely applying specific encapsulant materials (e.g，epoxyresins, silicones, etc.) onto semiconductor chip surfaces or other electronic components using dispensing equipment toform a protective layer.

Semiconductor dispensing encapsulation provides critical physical protection, electrical isolation, thermal management, and hermetic sealing—making it especially suitable for miniaturized and high-precision semiconductor devices.